We are seeking an experienced Mechanical Engineer to join our team, specializing in mechanical simulations for semiconductor packages. The ideal candidate will have a strong background in predicting stress and mechanical behaviour across various layers of both advanced 2.5D and standard semiconductor packages. You will be a part of a high-impact, high-visibility team. You will learn about all aspects of AI hardware development, from architecture to design to manufacturing to reliability.

This role is hybrid, based out of Taipei, Taiwan, Toronto, Canada or Austin, Texas.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Responsibilities:

• Perform mechanical simulations to predict stress, strain, and thermal behavior in semiconductor packages, including ELK layer, ubump, bump, C4 bump, and BGA.
• Conduct warpage prediction and mechanical optimization of semiconductor packages to minimize warpage and ensure package manufacturability and reliability.
• Analyze and optimize package designs for reliability and performance under various operating conditions.
• Collaborate with cross-functional teams, including design, process, and reliability engineers, to ensure robust package performance.
• Develop and validate simulation models to iterate through multiple design options.
• Provide technical insights and recommendations to improve package design and manufacturing processes through the architecture phase.
• Document simulation results and present findings to stakeholders.

Experience & Qualifications:

• Degree in Mechanical Engineering, Materials Science, or a related field.
• Minimum of 5 years of experience in mechanical simulation for semiconductor packaging.
• Expertise in stress analysis for chiplet-based advanced 2.5D packages and standard packages
• Proficiency with finite element analysis (FEA) tools such as ANSYS or Abaqus.
• Strong understanding of semiconductor packaging materials, structure, and manufacturing processes.
• Ability to work independently, collect input from various sources, and build models from scratch.
• Strong communication skills to present complex technical data clearly.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been licensing conditions set by the U.S. government.

Our engineering positions and certain engineering support positions require access to information, systems, or technologies that are subject to U.S. Export Control laws and regulations, please note that citizenship/permanent residency, asylee and refugee information and/or documentation will be required and considered as Tenstorrent moves through the employment process.

If a U.S. export license is required, employment will not begin until a license with acceptable conditions is granted by the U.S. government. If a U.S. export license with acceptable conditions is not granted by the U.S. government, then the offer of employment will be rescinded.